D A T A S H E E T
REVISION SUMMARY
Revision A (March 19, 2002)
Revision D+1 (September 10, 2002)
Initial release as abbreviated Advance Information
data sheet. This document contains information that
was previously released in publication number 25301.
Product Selector Guide
Added Note 2.
Ordering Information
Ordering Information
Added Note 1.
The package marking for the Fortified BGA option has
been updated.
Sector Erase Command Sequence
Deleted statement that describes the outcome of
when the Embedded Erase operation is in progress.
Physical Dimensions
Added drawing that shows both TS056 and TSR056
specifications.
Revision E (December 5, 2002)
Product Selector Guide and Read-Only
Characteristics
Revision B (April 26, 2002)
Expanded data sheet to full specification version.
Added a 30 ns option to tPACC and tOE standard for the
112R and 120R speed options.
Revision C (May 23, 2002)
Customer Lockable: SecSi Sector NOT
Programmed or Protected at the factory.
Changed packaging from 63-ball FBGA to 64-ball For-
tified BGA. Changed Block Diagram: Moved VIO from
RY/BY# to Input/Output Buffers. Changed note about
WP#/ACC pin to indicate internal pullup to VCC. Modi-
fied Table 4: Sector Group Protection/Unprotection Ad-
dress Table. Changed 47h Address data from 0004h
to 0001h in Table 9.
Added second bullet, SecSi sector-protect verify text
and figure 3.
SecSi Sector Flash Memory Region, and Enter
SecSi Sector/Exit SecSi Sector Command
Sequence
Noted that the ACC function and unlock bypass modes
are not available when the SecSi sector is enabled.
Revision D (August 8, 2002)
Alternate CE# Controlled Erase and Program
Operations
Byte/Word Program Command Sequence, Sector
Erase Command Sequence, and Chip Erase Com-
mand Sequence
Added tRH parameter to table.
Erase and Program Operations
Noted that the SecSi Sector, autoselect, and CFI
functions are unavailable when a program or erase
operation is in progress.
Added tBUSY parameter to table.
TSOP and BGA PIN Capacitance
Common Flash Memory Interface (CFI)
Added the FBGA package.
Changed CFI website address
Program Suspend/Program Resume Command
Sequence
Figure 6. Program Suspend/Program Resume
Changed 15 μs typical to maximum and added 5 μs
typical.
Change wait time to 15 μs.
CMOS Compatible
Erase Suspend/Erase Resume Commands
Added ILR row to table. Changed VIH1 and VIH2 mini-
mum to 1.9. Removed typos in notes.
Changed typical from 20 μs to 5 μs and added a maxi-
mum of 20 μs.
Hardware Reset, CMOS Tables, Erase and Program
Operations, Temporary Sector Unprotect, and
Alternate CE# Controlled Erase and Program
Operations
Special package handling instructions
Modified the special handling wording.
DC Characteristics table
Added Note.
Deleted the Iacc specification row.
Revision E+1 (February 16, 2003)
CFI
Distinctive Characteristics
Changed text in the third paragraph of CFI to read
“reading array data.”
Corrected performance characteristics.
December 14, 2005
Am29LV640MH/L
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SPANSION [ SPANSION ]
