D A T A S H E E T
Ordering Information
REVISION SUMMARY
Deleted burn-in option.
Revision A (August 12, 1999)
Revision C+1 (November 18, 2002)
Ordering Information
Initial release. The Am29F010B replaces the
Am29F010A data sheet (22181B+1).
Revision A+1 (September 22, 1999)
Device Bus Operations
Deleted the PE (PDIP, Extended Temperature Range)
combination from the 45, 55, and 70 ns speed options.
Operating Ranges
Sector Protection/Unprotection: Corrected the publica-
tion number for the programming supplement.
Changed Case Temperature to Ambient Temperature.
Revision A+2 (September 27, 1999)
Erase and Programming Performance table
Revision C+2 (September 22, 2004)
Added PB-Free option to Standard Ordering Matrix.
Updated Valid Combinations
In Notes 1 and 6, corrected the erase cycle endurance
to 1 million cycles.
Revision C+3 (April 5, 2005)
Added PE nomenclature to Valid Combinations.
Revision B (November 12, 1999)
AC Characteristics—Figure 9. Program Operations
Timing and Figure 10. Chip/Sector Erase
Operations
Revision C+4 (August 23, 2005)
Added Pb-free option for PLCC and PDIP packages.
Deleted t
high.
and changed OE# waveform to start at
GHWL
Revision C+5 (January 4, 2006)
Deleted TSR032 32-pin Reverse TSOP option.
Physical Dimensions
Revision C6 (July 27, 2006)
Replaced figures with more detailed illustrations.
Added notice to first page of data sheet and cover
page.
Revision C (November 28, 2000)
Global
Revision C7 (October 31, 2006)
Removed notice to first page of data sheet and cover
page.
Added table of contents. Removed Preliminary status
from document.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products
Trademarks
Copyright ©1997-2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright ©2006 Spansion Inc. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are
trademarks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trade-
marks of their respective companies
October 31, 2006 Am29F010B_00_C7
Am29F010B
31
SPANSION [ SPANSION ]
