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AM29BDS640GT93WSF 参数 Datasheet PDF下载

AM29BDS640GT93WSF图片预览
型号: AM29BDS640GT93WSF
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 4MX16, 20ns, PBGA80, 11 X 12 MM, FBGA-80]
分类和应用: 内存集成电路
文件页数/大小: 62 页 / 863 K
品牌: SPANSION [ SPANSION ]
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A D V A N C E I N F O R M A T I O N  
Table 4. System Interface String  
Description  
Addresses  
Data  
VCC Min. (write/erase)  
D7–D4: volt, D3–D0: 100 millivolt  
1Bh  
0017h  
V
CC Max. (write/erase)  
1Ch  
0019h  
D7–D4: volt, D3–D0: 100 millivolt  
1Dh  
1Eh  
1Fh  
20h  
21h  
22h  
23h  
24h  
25h  
26h  
0000h  
0000h  
0004h  
0000h  
0009h  
0000h  
0004h  
0000h  
0004h  
0000h  
VPP Min. voltage (00h = no VPP pin present)  
VPP Max. voltage (00h = no VPP pin present)  
Typical timeout per single byte/word write 2N µs  
Typical timeout for Min. size buffer write 2N µs (00h = not supported)  
Typical timeout per individual block erase 2N ms  
Typical timeout for full chip erase 2N ms (00h = not supported)  
Max. timeout for byte/word write 2N times typical  
Max. timeout for buffer write 2N times typical  
Max. timeout per individual block erase 2N times typical  
Max. timeout for full chip erase 2N times typical (00h = not supported)  
Table 5. Device Geometry Definition  
Description  
Addresses  
Data  
27h  
0017h  
Device Size = 2N byte  
28h  
29h  
0001h  
0000h  
Flash Device Interface description (refer to CFI publication 100)  
2Ah  
2Bh  
0000h  
0000h  
Max. number of bytes in multi-byte write = 2N  
(00h = not supported)  
2Ch  
0003h  
Number of Erase Block Regions within device  
2Dh  
2Eh  
2Fh  
30h  
0003h  
0000h  
0040h  
0000h  
Erase Block Region 1 Information  
(refer to the CFI specification or CFI publication 100)  
31h  
32h  
33h  
34h  
007Dh  
0000h  
0000h  
0001h  
Erase Block Region 2 Information  
Erase Block Region 3 Information  
Erase Block Region 4 Information  
35h  
36h  
37h  
38h  
0003h  
0000h  
0040h  
0000h  
39h  
3Ah  
3Bh  
3Ch  
0000h  
0000h  
0000h  
0000h  
May 9, 2002  
Am29BDS640G  
15  
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