A D V A N C E I N F O R M A T I O N
PHYSICAL DIMENSIONS
FBE080—80-ball Fine-Pitch Ball Grid Array (FBGA)
11 x 12 mm Package
0.20
(4X)
D1
A
D
eD
8
eE
7
7
6
SE
5
4
E1
E
3
2
1
M
L
K
J
H
G
F
E
D
C
B
A
A1 CORNER
7
B
A1 CORNER INDEX MARK
10
6
NXOb
SD
M
φ0.08
Z
TOP VIEW
φ0.15 M
Z A B
BOTTOM VIEW
0.25 Z
0.08 Z
A2
A
A1
Z
SEATING PLANE
SIDE VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
PACKAGE
JEDEC
FBE 080
N/A
10.95 mm x 11.95 mm
PACKAGE
NOTE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL
MIN. NOM. MAX.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
---
1.20
---
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE
IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER
BALLS.
0.20
0.84
---
---
0.94
BODY THICKNESS
BODY SIZE
11.95 BSC.
E
10.95 BSC.
8.80 BSC.
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM Z.
D1
E1
MD
ME
BALL FOOTPRINT
5.60 BSC.
12
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
ROW MATRIX SIZE D DIRECTION
8
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
N
b
80
0.25
0.30
0.35
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
A3-A6, B3-B6,
L3-L6, M3-M6
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. "+" IN THE PACKAGE DRAWING INDICATES THE THEORETICAL
CENTER OF DEPOPULATED BALLS.
E
PACKAGE OUTLINE TYPE
9
FOR PACKAGE THICKNESS, "A" IS THE CONTROLLING DIMENSION.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, INK MARK,
METALLIZED MARKINGS INDENTION OR OTHER MEANS.
3150\38.9G
Note: BSC is an ANSI standard for Basic Space Centering
62
Am29BDS640G
October 31, 2002
SPANSION [ SPANSION ]
