CXA3106Q
Notes on Operation
• Be sure not to separate the analog and digital power supplies, and the analog and digital GND.
• The ground pattern should be as wide as possible. Using a multi-layer substrate with a mat ground is
recommended.
• Ground the power supply pins of the IC with a 0.1µF or larger ceramic chip capacitor as close to each pin as
possible.
• Be sure to accurately match the I/O characteristic impedance in order to ensure sufficient performance during
high-speed operation.
• Design the set so that the loop filter (external) is located at the minimum distance. (See the CXA3106Q
PWB.)
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SONY [ SONY CORPORATION ]
