10 Mbps ARCNET (ANSI 878.1) Controller with 2Kx8 On-Chip RAM
Datasheet
Chapter 9 Package Outline
Figure 9.1 - COM20022I 48 Pin TQFP Package Outline
Table 9.1 - COM20022I 48 Pin TQFP Package Parameters
MIN
~
NOMINAL
MAX
1.6
REMARK
Overall Package Height
Standoff
A
A1
A2
D
D/2
D1
E
E/2
E1
H
~
0.10
1.40
9.00
4.50
7.00
9.00
4.50
7.00
~
0.05
1.35
8.80
4.40
6.90
8.80
4.40
6.90
0.09
0.45
~
0.15
1.45
9.20
4.60
7.10
9.10
4.60
7.10
0.20
0.75
~
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
L
L1
e
0.60
1.00
0.50 Basic
~
Lead Pitch
Lead Foot Angle
0o
0.17
0.08
0.08
~
7o
0.27
~
0.20
0.0762
0.08
θ
W
R1
R2
ccc
ccc
~
~
~
~
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
~
~
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 09-27-07
Page 78
SMSC COM20022I
DATASHEET
SMSC [ SMSC CORPORATION ]
