SL74HC109
M A X I M U M R A T I N G S *
Symbol
Parameter
Value
Unit
V
VCC
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
-0.5 to +7.0
VIN
-1.5 to VCC +1.5
-0.5 to VCC +0.5
V
V
VOUT
±
IIN
20
mA
mA
mA
mW
±
IOUT
DC Output Current, per Pin
25
±
ICC
DC Supply Current, VCC and GND Pins
50
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
°
Tstg
Storage Temperature
-65 to +150
260
C
°
T
L
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
°
°
°
+Derating - Plastic DIP: - 10 mW/ C from 65 to 125 C
°
°
°
SOIC Package: : - 7 mW/ C from 65 to 125 C
R E C O M M E N D E D O P E R A T I N G C O N D I T I O N S
Symbol
Parameter
Min
2.0
0
Max
6.0
Unit
V
VCC
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
VIN, VOUT
VCC
V
°
T
A
-55
+125
C
t
r
, t
f
Input Rise and Fall Time (Figure 1)
V
V
V
CC =2.0 V
CC =4.5 V
CC =6.0 V
0
0
0
1000
500
400
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range
£
£
GND (VIN or VOUT) VCC
.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.
System Logic
Semiconductor
SLS
SLS [ SYSTEM LOGIC SEMICONDUCTOR ]
