DATA SHEET • DSG9500-000
Beam-Lead Diodes
Handling
Due to their small size, beam-lead devices are fragile and should
be handled with extreme care. The individual plastic packages
should be handled and opened carefully, so that no undue
mechanical strain is applied to the packaged device. It is recom-
mended that the beam-lead devices be handled through use of a
vacuum pencil using an appropriate size vacuum needle or a
pointed wooden stick such as a sharpened Q-tip or match stick.
The device will adhere to the point and can easily be removed
from the container and positioned accurately for bonding without
damage. Such handling should be done under a binocular micro-
scope with magnification in the range of 20X to 30X.
Equipment
The heat and pressure are obtained through use of a silicon car-
bide bonding tip with a radius of two to three mils. Such an item
is available from several commercial sources. In order to supply
the required tip-travel and apply proper pressure, a standard
miniature weld head can be used. Also available is a heated
wedge shank which is held by the weld head and in turn holds
the tip and supplies heat to it. The wedge shank is heated by
means of a simple AC power supply or a pulse type heated tool.
Special handling precautions are also required to avoid electrical
damage, such as static discharge.
Bonding
The DSG9500-000 can best be bonded to substrates by means of
thermocompression bonding. Essentially this type of bonding
involves pressing the gold beam of the device against the gold
plated metalized substrate under proper conditions of heat and
pressure so that a metallurgical bond joint between the two
occurs.
Substrate
For optimum bonding a gold plated surface at least 100
microinches thick is necessary. Although it is possible to bond to
relatively soft metalized substrate material such as epoxy-fiber-
glass, etc., optimum bonding occurs when a hard material such
as ceramic can be used.
Procedure
The beam-lead devices to be bonded should be placed on a
clean, hard surface such as a microscope slide. It is recom-
mended that the beam side of the device be down so that this
side will be toward the substrate when bonded. The device can
be picked up by pressing lightly against one beam with the
heated tip. The substrate can then be appropriately positioned
under the tip and the device brought down against the substrate,
with proper pressure applied by means of the weld head.
Quality
If a good bond has been obtained, it is impossible to separate the
beam-lead device from the metalized substrate without damage.
If the device is destructively removed, the beam will tear away,
leaving the bonded portion attached to the substrate.
A bonding tip temperature in the 350 °C to 450 °C range is rec-
ommended along with a bonding force of 50 to 70 grams. The
bonding time is in the range of 2 to 3 seconds. Optimum bonding
conditions should be determined by trial and error to compensate
for slight variations in the condition of the substrate, bonding tip,
and the type of device being bonded.
Beam–Lead Packaging
The DSG-9500-000 is shipped in 2" x 2" black gel packs. The
beam-leads are mounted on the gel, the devices are covered
with a piece of lint-free release paper, on top of which is placed
a piece of conductive foam.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 7, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200137 Rev. A
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