DATA SHEET • DSG9500-000
38
36
32
28
24
20
16
12
8
Performance Data for DSG9500–000
Figures 1 and 2 show a single pole double-throw 1–18 GHz
switch these diodes are mounted an Alumina, Duroid, or Teflon
fiberglass 50 Ω microstrip circuits. Typical bonding methods
include thermal compression bonding, parallel gap welding, and
soldering.
SPDT isolation curves are shown in Figure 3 and insertion loss in
Figures 4 and 5. With proper transitions and bias circuits, VSWR
is better than 2.0 to 1 through 18 GHz.
4
0
0
2
4
6
8
10 12 14 16 18
Switching Considerations
The typical minority carrier lifetime of the DSG9500 diodes is
100 ns. With suitable drivers, the individual diodes can be
Frequency (GHz)
Figure 3. Isolation vs. Frequency, SPDT
switched from high impedance (off) to low R (on) in about 10 ns.
S
2.5
Beam Lead Pin
Duroid Substrate
50 Ω
Glass Bead
2.0
1.5
1.0
0.5
0
Connecting
Lead
50 Ω
Transmission LIne
Figure 1. Typical SPDT Circuit Arrangement
0
10
50
100
Bias Current (mA)
Preferred Beam
Beam Lead Pin
Figure 4. Diode Insertion Loss vs. Bias,
SPST 18 GHz
Lead Orientation
0.005"
Metal Conductor
Duroid
Figure 2. Typical Beam Lead Mounting
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 7, 2005 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200137 Rev. A
2
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