C8051F50x-F51x
4.4. QFP-32 Package Specifications
Figure 4.7. QFP-32 Package Drawing
Table 4.7. QFP-32 Package Dimensions
Dimension
Min
Typ
Max
Dimension
Min
Typ
Max
A
A1
A2
b
c
D
D1
—
—
—
1.40
0.37
—
1.60
0.15
1.45
0.45
0.20
E
E1
L
aaa
bbb
ccc
ddd
9.00 BSC.
7.00 BSC.
0.60
0.05
1.35
0.30
0.09
0.45
0.75
0.20
0.20
0.10
0.20
9.00 BSC.
7.00 BSC.
0.80 BSC.
e
0°
3.5°
7°
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC outline MS-026, variation BBA.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
36
Rev. 1.1
SILICON [ SILICON ]
