C8051F336/7/8/9
4. QFN-20 Package Specifications
Figure 4.1. QFN-20 Package Drawing
Table 4.1. QFN-20 Package Dimensions
Dimension
Min
Typ
Max
Dimension
Min
Typ
Max
A
0.80
0.00
0.18
0.90
0.02
1.00
0.05
0.30
E2
L
2.05
0.30
0.00
—
2.15
0.40
—
2.25
0.50
0.15
0.15
0.10
0.05
0.08
A1
b
0.25
L1
D
4.00 BSC.
2.15
aaa
bbb
ddd
eee
—
D2
2.05
2.25
—
—
e
E
0.50 BSC.
4.00 BSC.
—
—
—
—
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220, variation VGGD except for
custom features D2, E2, and L which are toleranced per supplier designation.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small
Body Components.
32
Rev. 0.2
SILICON [ SILICON ]
