C8051F336/7/8/9
5. QFN-24 Package Specifications
Figure 5.1. QFN-24 Package Drawing
Table 5.1. QFN-24 Package Dimensions
Dimension
Min
Typ
Max
Dimension
Min
Typ
Max
A
0.70
0.00
0.18
0.75
0.02
0.80
0.05
0.30
E2
L
2.60
0.35
0.00
—
2.70
0.40
—
2.80
0.45
0.15
0.15
0.10
0.05
0.08
A1
b
0.25
L1
D
D2
4.00 BSC.
2.70
aaa
bbb
ccc
ddd
—
2.60
2.80
—
—
e
0.50 BSC.
4.00 BSC.
—
—
E
—
—
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to JEDEC Solid State Outline MO-220, variation WGGD except for
custom features D2, E2, and L which are toleranced per supplier designation.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small
Body Components.
Rev. 0.2
33
SILICON [ SILICON ]
