Preliminary
GM5BW94320A
● Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 18 shows the recommended solder pad design for this part.
3. When using backside dip methods, Sharp recommends checking the process carefully: board warping from heat
can cause mechanical failure in these parts, in addition to the high heat conducted into the part through the
leads. Performing reflow after dip is recommended, with the interval between the two as short as possible.
Fig. 18 Recommended Solder Pad Design
0.3
0.3
0.7
0.6
0.7
2.60
NOTE: Units: mm
GM5BW94320A-20
Sheet No.: DG-067010A
13
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
