5. Reliability Test
Duration
/ Cycle
Number of
Damage
Item
Reference
Test Condition
Internal
Thermal Shock
Temperature Cycle
Ta =-40oC (30MIN) ~ 100oC (30MIN)
100 Cycle
100 Cycle
0/22
0/22
0/22
Reference
Ta =-40oC (30MIN) ~ 25oC (5MIN)
EIAJ ED-4701
EIAJ ED-4701
~ 100oC (30MIN) ~ 25oC (5MIN)
High Temperature
Storage
Ta =100oC
1,000 Hours
High Temperature
High Humidity
Storage
EIAJ ED-4701
Ta =85oC, RH=85%
1,000 Hours
0/22
Low Temperature
Storage
EIAJ ED-4701
Ta =-40oC
1,000 Hours
1,000 Hours
0/22
0/22
Operating
Internal
Ta =25oC, IF =20mA
Endurance Test
Reference
High Temperature /
Humidity Life
Internal
Ta =60oC, RH=90%, IF =20mA
1,000 Hours
1,000 Hours
1,000 Hours
3 Time
0/22
0/22
0/22
0/22
Reference
High Temperature
Life Test
Internal
Ta =60oC, IF =20mA
Ta =-40oC, IF =20mA
1KV at 1.5kΩ; 100pF
Reference
Low Temperature
Life Test
Internal
Reference
MIL-STD-
883D
ESD(HBM)
* Criteria for Judging the Damage
Criteria for Judgement
MIN MAX
Item
Symbol
Condition
Forward Voltage
Reverse Current
Luminous Intensity
VF
IR
IF =20mA
VR=5V
-
USL*1 × 1.1
-
100 µA
IV
IF =20mA
LSL*2 × 0.7
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
*ESD guarantee condition
Item
Test Condition
Criteria for Judgement
Test Form
HBM
1,000 V
IR =100 ㎂ and below
CONTACT
Rev. 00
January, 2009
www.acriche.com
Document No. : SSC-QP-7-07-24 (Rev.00)
SEOUL [ Seoul Semiconductor ]
