10. soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
120 sec. Max.
240℃ Max.
Pre-heating
Pre-heat time
Peak-Temperature
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Above 200 C
Soldering time
Condition
120sec. Max.
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
150~200℃
120 sec. Max.
260℃ Max.
Pre-heating
o
Pre-heat time
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Above 220 C
Peak-Temperature
Soldering time
Condition
120sec. Max.
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
January, 2009
www.acriche.com
Document No. : SSC-QP-7-07-24 (Rev.00)
SEOUL [ Seoul Semiconductor ]
