Typical Characteristics (continued)
1.2
1.1
1.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
* Note :
1. VGS = 0 V
0.9
∗
Note :
1. VGS = 10 V
2. ID = 250 μA
2. ID = 1.0 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
T, Junction Temperature [oC]
J
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
20
16
12
8
Operation in This Area
is Limited by R DS(on)
102
101
100
10-1
10-2
100 μs
1 ms
10 ms
100 ms
DC
* Notes :
4
1. TC = 25 o
C
2. TJ = 150 o
C
3. Single Pulse
0
25
100
101
102
50
75
100
125
150
TC, Case Temperature [℃]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
1 0 0
D = 0 .5
0 .2
※
N o te s
:
1 0 -1
1 . Z θ (t)
=
0 .9 ℃ /W M a x .
2 . D u ty F a c to r, D = t1 /t2
3 . T JM T C P D M Z θ (t)
JC
0 .1
-
=
*
JC
0 .0 5
0 .0 2
0 .0 1
PDM
t1
1 0 -2
s in g le p u ls e
t2
1 0 -5
1 0 -4
1 0 -3
1 0 -2
1 0 -1
1 0 0
1 0 1
t1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,July 2005
SEMIHOW [ SEMIHOW CO.,LTD. ]
