STG8205
Ver 1.0
PACKAGE OUTLINE DIMENSIONS
T S S OP -8
DETAIL A
DETAIL A
MIN
0.85
0.80
0.19
MAX
MIN
0.033
0.031
0.007
MAX
0.30
2
3
0.012
2
3
Notes: 1. This drawing is for general information only.Refer to JEDEC Drawing MO-153,Variation AA,for
proper dimensions,tolerances,datums,etc.
2. Dimension D does not include mold Flash,protrusions or gate burrs.Mold Flash,protrusions and
gate burrs shall not exceed 0.15 mm (0.006 in) per side.
3. Dimension E does not include inter-lead Flash or protrusions.Inter-lead Flash and protrusions
shall not exceed 0.25mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion.Allowable Dambar protrusion shall be 0.08 mm
total in excess of the b dimension at maximum material condition.Dambar cannot be located on
the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E to be determined at Datum Plane H.
Sep,17,2009
6
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SAMHOP [ SAMHOP MICROELECTRONICS CORP. ]
