LM393DR/PWR/DGKR,LM2903DR/PWR/DGKR/VQDR/VQPWR
LM339DR/PWR,LM2901DR/PWR/VQDR/VQPWR
Technical Note
●Derating Curves
800
1000
800
600
400
200
0
LM393PWR
LM2903PWR/VQPWR
LM339PWR
LM2901PWR/VQPWR
600
LM339DR
LM2901DR/VQDR
LM393PWR
LM2903PWR/VQPWR
400
LM393DR
LM2903DR/VQDR
200
0
0
25
50
75
100
125
150
0
25
50
75
100 125 150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
LM393DR/PWR/DGKR
LM339DR/PWR
LM2903DR/PWR/DGKR/VQDR/VQPWR
LM2901DR/PWR/VQDR/VQPWR
Power Dissipation
Power Dissipation
Package
SOIC8 (*8)
Pd[W]
450
θja [℃/W]
3.6
Package
SOIC14
Pd[W]
610
θja [℃/W]
4.9
7.0
500
470
4.0
TSSOP14
870
TSSOP8 (*6)
3.76
MSOP8/VSSOP8 (*7)
θja = (Tj-Ta)/Pd[℃/W]
θja = (Tj-Ta)/Pd[℃/W]
Fig.91 Derating Curves
Vcc
●Precautions
1) Unused circuits
When there are unused circuits it is recommended that they be connected as in Fig.92,
setting the non-inverting input terminalto a potential within the in-phase input voltage range (VICR).
－
＋
2) Input terminal voltage
Applying GND + 36V to the input terminal is possible without causing deterioration of the electrical
characteristics or destruction, irrespective of the supply voltage. However, this does not ensure
normal circuit operation.
Please note that the circuit operates normally only when the input voltage is within the common
mode input voltage range of the electric characteristics.
GND
Fig.92 Disable circuit example
3) Power supply (single / dual)
The op-amp operates when the specified voltage supplied is between Vcc and GND. Therefore, the single supply op-amp can be used as
a dual supply op-amp as well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip
temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual
operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power
supply, or the output and GND may result in IC destruction.
6) Terminal short-circuits
When the output and Vcc terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently,
destruction.
7) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
8) Radiation
This IC is not designed to withstand radiation.
9) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to
piezoelectric (piezo) effects.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is
recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before
inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and
storage.
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