RT9164A
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. Low duty cycle pulse testing with Kelvin connections.
Note 5. The dropout voltage is defined as VIN -VOUT, which is measured when VOUT is VOUT(NORMAL) − 100mV.
Note 6. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard. The case point of θJC is on the center of the exposed pad. The pad size
is 6mm2 on SOT-223 packages, 100mm2 on TO-252 packages, 125mm2 on TO-263 packages.
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DS9164A-13 August 2007
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
