RT7339P
To reduce the parasitic trace inductance and EMI,
the area of the loop connecting to the secondary
winding, the output diode, and the output filter
capacitor must be minimized. In addition, the
sufficient copper area at the anode and cathode
terminal of the output diode can help for heat-sinking.
It is recommended to apply the larger area at the
quiescent cathode terminal. The large anode area
will induce high-frequency radiated EMI.
C
IN
+
(3)
AC
input
V
OUT
(a)
-
(4)
VDD
RT7339P
COMP
C
VDD
GATE
Input Capacitor
Ground (a)
C
COMP
GND
(d)
CS
(2)
(b)
Trace
(1)
(c)
Trace Trace
DMAG
IC
Auxiliary
MOSFET
Ground (b)
Ground (d)
Ground (c)
Figure 7. PCB Layout Guide
Copyright © 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
DS7339P-03
August 2019
www.richtek.com
17
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