RT2560Q
The maximum power dissipation depends on operating
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
. The Figure 2 of derating curves allows the
designer to see the effect of rising ambient temperature
on the maximum power allowed.
(C) Copper Area = 30mm
2
,
θ
JA
= 54°C/W
Power Dissipation (W)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
Copper Area
70mm
2
50mm
2
30mm
2
10mm
2
Min. Layout
(d) Copper Area = 50mm
2
,
θ
JA
= 51°C/W
JEDEC 4-Layer PCB
Ambient Temperature (°C)
Figure 2. Derating Curve for Package
(e) Copper Area = 70mm
2
,
θ
JA
= 49°C/W
Figure 1. Thermal Resistance vs. Copper Area Layout
Thermal Design
Copyright
©
2016 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
DS2560Q-01 February 2016
www.richtek.com
9
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