FPD1050
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible.
The back of the die is metallized and the recommended mounting method is by the use of conductive epoxy. Epoxy should be
applied to the attachment surface uniformly and sparingly to avoid encroachment of epoxy on to the top face of the die and
ideally should not exceed half the chip height. For automated dispense Ablestick LMISR4 is recommended. For manual dis-
pense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a temperature of 150°C for 1 hour in an
oven especially set aside for epoxy curing only. If possible, the curing oven should be flushed with dry nitrogen. The gold-tin
(80% Au 20% Sn) eutectic die attach has a melting point of approximately 280°C but the absolute temperature being used
depends on the leadframe material used and the particular application. The maximum time should be kept to a minimum.
This part has gold (Au) bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4mm diameter
gold wire be used. Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter
wire. Bond force, time stage temperature, and ultrasonics are all critical parameters and the settings are dependant on the
setup and application being used. Ultrasonic or thermosonic bonding is not recommended.
Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires
should be minimized especially when making RF or ground connections.
Handling Precautions
To avoid damage to the devices, care should be exercised during handling. Proper
Electrostatic Discharge (ESD) precautions should be observed at all stages of storage,
handling, assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 0 (0V to 250V) using the human body model as defined in JEDEC Standard No. 22-
A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
Application Notes and Design Data
Application Notes and design data including S-parameters and device model are available on request and from
www.rfmd.com.
Reliability
An MTTF of in excess of 4.2 million hours at a channel temperature of 150°C is achieved for the process used to manufacture
this device.
Disclaimers
This product is not designed for use in any space-based or life-sustaining/supporting equipment.
Ordering Information
Delivery Quantity
Ordering Code
FPD1050-000
Standard Order Quantity (waffle-pack)
Small Quantity (25)
FPD1050-000SQ
FPD1050-000S3
Small Quantity (3)
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RFMD [ RF MICRO DEVICES ]
