ICL7611, ICL7612
Ordering Information
PART NUMBER
PART MARKING
7611 DCBA
7611 DCBAZ
7611 DCBA
7611 DCBAZ
7611 DCPA
TEMP. RANGE (°C)
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
PACKAGE
8 Ld SOIC (150 mil)
PKG. DWG. #
M8.15
ICL7611DCBA
ICL7611DCBAZ (Note)
ICL7611DCBA-T
8 Ld SOIC (150 mil) (Pb-free)
M8.15
8 Ld SOIC (150 mil) Tape and Reel
M8.15
ICL7611DCBAZ-T (Note)
ICL7611DCPA
8 Ld SOIC (150 mil) Tape and Reel (Pb-free) M8.15
8 Ld PDIP
E8.3
ICL7611DCPAZ (Note)
ICL7612BCPA
7611 DCPAZ
7612 BCPA
8 Ld PDIP* (Pb-free)
8 Ld PDIP
E8.3
E8.3
ICL7612BCPAZ
7612 BCPAZ
7612 DCBA
7612 DCBA
7612 DCBAZ
7612 DCBAZ
7612 DCPA
7612 DCPAZ
8 Ld PDIP* (Pb-free)
8 Ld SOIC (150 mil)
8 Ld SOIC (150 mil) Tape and Reel
8 Ld SOIC (150 mil) (Pb-free)
8 Ld SOIC (150 mil) Tape and Reel (Pb-free)
8 Ld PDIP
E8.3
ICL7612DCBA
M8.15
M8.15
M8.15
M8.15
E8.3
ICL7612DCBA-T
ICL7612DCBAZ (Note)
ICL7612DCBAZ-T (Note)
ICL7612DCPA
ICL7612DCPAZ (Note)
8 Ld PDIP* (Pb-free)
E8.3
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
FN2919 Rev 9.00
April 26, 2007
Page 2 of 13
RENESAS [ RENESAS TECHNOLOGY CORP ]
