欢迎访问ic37.com |
会员登录 免费注册
发布采购

HD64F3337YF16 参数 Datasheet PDF下载

HD64F3337YF16图片预览
型号: HD64F3337YF16
PDF下载: 下载PDF文件 查看货源
内容描述: 单片机 [Single-Chip Microcomputer]
分类和应用: 微控制器和处理器外围集成电路
文件页数/大小: 747 页 / 2993 K
品牌: RENESAS [ RENESAS TECHNOLOGY CORP ]
 浏览型号HD64F3337YF16的Datasheet PDF文件第398页浏览型号HD64F3337YF16的Datasheet PDF文件第399页浏览型号HD64F3337YF16的Datasheet PDF文件第400页浏览型号HD64F3337YF16的Datasheet PDF文件第401页浏览型号HD64F3337YF16的Datasheet PDF文件第403页浏览型号HD64F3337YF16的Datasheet PDF文件第404页浏览型号HD64F3337YF16的Datasheet PDF文件第405页浏览型号HD64F3337YF16的Datasheet PDF文件第406页  
Write and verify program  
Bake with power off  
125°C to 150°C,  
24 Hr to 48 Hr  
Read and check program  
Install  
Figure 18.7 Recommended Screening Procedure  
If a series of write errors occurs while the same PROM programmer is in use, stop programming  
and check the PROM programmer and socket adapter for defects, using a microcontroller with on-  
chip EPROM in a windowed package, for instance.  
Please inform Hitachi of any abnormal conditions noted during programming or in screening of  
program data after high-temperature baking.  
18.3.4  
Erasing Data  
Data is erased by exposing the transparent window in the package to ultraviolet light. The erase  
conditions are shown in table 18.7.  
Table 18.7 Erase Conditions  
Item  
Value  
Ultraviolet wavelength  
Minimum irradiation  
253.7nm  
15W s/cm2  
The erase conditions in table 18.7 can be met by exposure to a 12000 µW/cm2 ultraviolet lamp  
positioned 2 to 3 cm directly above the chip for approximately 20 minutes.  
372  
 复制成功!