QN8006B/8006LB
9 SOLDER REFLOW PROFILE
9.1 Package Peak Reflow Temperature
QN8006 is assembled in a lead-free QFN24 package. Since the geometrical size of QN8006 is 4 × 4 × 0.85 mm3, the
volume and thickness is in the category of volume<350 mm3 and thickness<1.6 mm in Table 4-2 of IPC/JEDEC J-STD-
020C. The peak reflow temperature is:
Tp = 260o C
The temperature tolerance is +0oC and -5oC. Temperature is measured at the top of the package.
9.2 Classification Reflow Profiles
Profile Feature
Specification*
3°C/second max.
150°C
Average Ramp-Up Rate (tsmax to tP)
Temperature Min (Tsmin)
Pre-heat:
Temperature Max (Tsmax)
Time (ts)
200°C
60-180 seconds
Time
maintained
above:
Temperature (TL)
Time (tL)
217°C
60-150 seconds
260°C
Peak/Classification Temperature (Tp)
Time within 5°C of Actual Peak
Temperature (tp)
20-40 seconds
Ramp-Down Rate
6°C/second max.
8 minutes max.
Time 25°C to Peak Temperature
*Note: All temperatures are measured at the top of the package.
Rev 2.08 (04/10)
Copyright ©2010 by Quintic Corporation
Page 57
Confidential A
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
QUANTUM [ QUANTUM RESEARCH GROUP ]
