QN8006B/8006LB
8 PACKAGE DESCRIPTION
24-Lead plastic Quad Flat, No Lead Package (ML) – 4x4 mm2 Body [QFN]
Figure 15: QN8006B/8006L-B Device
Units
Millimeters
NOM
Dimension Limits
MIN
MAX
Number of pins
Pitch
24
0.50 BSC
0.85
Overall Height （SLP）
Standoff
0.80
0.00
0.90
0.05
Contact Thickness
Overall Width
0.203 REF
4.00 BSC
2.70
Exposed Pad Width
Overall Length
2.65
2.75
4.00 BSC
2.70
Exposed Pad Length
Contact Width
2.65
0.20
0.35
-
2.75
0.30
0.45
-
0.25
Contact Length
0.40
Contact-to-Exposed Pad
0.25
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerance per ASME Y 14.5M.
BSC: Basic Dimension. The theoretically exact value is shown without tolerance.
REF: Reference Dimension, usually without tolerance, for information purpose only.
Rev 2.08 (04/10)
Copyright ©2010 by Quintic Corporation
Page 55
Confidential A
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
QUANTUM [ QUANTUM RESEARCH GROUP ]
