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HYS64T256022EDL-2.5-B 参数 Datasheet PDF下载

HYS64T256022EDL-2.5-B图片预览
型号: HYS64T256022EDL-2.5-B
PDF下载: 下载PDF文件 查看货源
内容描述: 200针双芯片小外形- DDR2 -SDRAM模块 [200-Pin Dual Die Small-Outline-DDR2-SDRAM Modules]
分类和应用: 存储内存集成电路动态存储器双倍数据速率时钟
文件页数/大小: 40 页 / 2384 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HYS64T256022EDL–[25F/2.5/3/3S/3.7]–B  
Small Outline DDR2 SDRAM Modules  
3
Electrical Characteristics  
3.1  
Absolute Maximum Ratings  
Caution is needed not to exceed absolute maximum ratings of the DRAM device listed in Table 8 at any time.  
TABLE 8  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Min.  
Unit  
Note  
Max.  
1)  
VDD  
Voltage on VDD pin relative to VSS  
Voltage on VDDQ pin relative to VSS  
Voltage on VDDL pin relative to VSS  
Voltage on any pin relative to VSS  
Storage Temperature  
–1.0  
–0.5  
–0.5  
–0.5  
–55  
+2.3  
+2.3  
+2.3  
+2.3  
+100  
V
1)2)  
1)2)  
1)  
VDDQ  
VDDL  
V
V
VIN, VOUT  
TSTG  
V
1)2)  
°C  
1) When VDD and VDDQ and VDDL are less than 500 mV; VREF may be equal to or less than 300 mV.  
2) Storage Temperature is the case surface temperature on the center/top side of the DRAM.  
Attention: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to  
the device. This is a stress rating only and functional operation of the device at these or any other  
conditions above those indicated in the operational sections of this specification is not implied. Exposure  
to absolute maximum rating conditions for extended periods may affect reliability.  
TABLE 9  
DRAM Component Operating Temperature Range  
Symbol  
Parameter  
Rating  
Unit  
Note  
Min.  
Max.  
1)2)3)4)  
TOPER  
Operating Temperature  
0
95  
°C  
1) Operating Temperature is the case surface temperature on the center / top side of the DRAM.  
2) The operating temperature range are the temperatures where all DRAM specification will be supported. During operation, the DRAM case  
temperature must be maintained between 0 - 95 °C under all other specification parameters.  
3) Above 85 °C the Auto-Refresh command interval has to be reduced to tREFI= 3.9 µs  
4) When operating this product in the 85 °C to 95 °C TCASE temperature range, the High Temperature Self Refresh has to be enabled by  
setting EMR(2) bit A7 to “1”. When the High Temperature Self Refresh is enabled there is an increase of IDD6 by approximately 50%  
Rev. 1.0, 2006-11  
12  
11172006-DXYK-2PPW  
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