HYS[64/72]D[16/32/64][300/301/320][G/H]U–[5/6]–C
Unbuffered DDR SDRAM Modules
Overview
Table 2
Ordering Information for Lead-Free Products
Product Type2)
Compliance Code
Description
SDRAM Technology
PC3200 (CL=3)
HYS64D16301GU–5–C
HYS64D32300GU–5–C
HYS72D32300GU–5–C
HYS64D64320GU–5–C
HYS72D64320GU–5–C
PC2700 (CL=2.5)
PC3200U–30330–C0 one rank 128MB DIMM
PC3200U–30330–A0 one rank 256MB DIMM
256 Mbit (×16)
256 Mbit (×8)
PC3200U–30330–A0 one rank 256MB ECC-DIMM 256 Mbit (×8)
PC3200U–30330–B0 two ranks 512MB DIMM 256 Mbit (×8)
PC3200U–30330–B0 two ranks 512MB ECC-DIMM 256 Mbit (×8)
HYS64D16301GU–6–C
HYS64D32300GU–6–C
HYS72D32300GU–6–C
HYS64D64320GU–6–C
HYS72D64320GU–6–C
PC2700U–25330–C0 one rank 128MB DIMM
PC2700U–25330–A0 one rank 256MB DIMM
256 Mbit (×16)
256 Mbit (×8)
PC2700U–25330–A0 one rank 256MB ECC-DIMM 256 Mbit (×8)
PC2700U–25330–B0 two ranks 512MB DIMM 256 Mbit (×8)
PC2700U–25330–B0 two ranks 512MB ECC-DIMM 256 Mbit (×8)
Table 3
Ordering Information for Lead-Free (RoHS1) Compliant Products)
Product Type2)
Compliance Code
Description
SDRAM Technology
PC3200 (CL=3)
HYS64D16301HU–5–C
HYS64D32300HU–5–C
HYS72D32300HU–5–C
HYS64D64320HU–5–C
HYS72D64320HU–5–C
PC2700 (CL=2.5)
PC3200U–30330–C0
PC3200U–30330–A0
PC3200U–30330–A0
PC3200U–30330–B0
PC3200U–30330–B0
one rank 128MB DIMM
256 Mbit (×16)
256 Mbit (×8)
256 Mbit (×8)
256 Mbit (×8)
256 Mbit (×8)
one rank 256MB DIMM
one rank 256MB ECC-DIMM
two ranks 512MB DIMM
two ranks 512MB ECC-DIMM
HYS64D16301HU–6–C
HYS64D32300HU–6–C
HYS72D32300HU–6–C
HYS64D64320HU–6–C
HYS72D64320HU–6–C
PC2700U–25330–C0
PC2700U–25330–A0
PC2700U–25330–A0
PC2700U–25330–B0
PC2700U–25330–B0
one rank 128MB DIMM
256 Mbit (×16)
256 Mbit (×8)
256 Mbit (×8)
256 Mbit (×8)
256 Mbit (×8)
one rank 256MB DIMM
one rank 256MB ECC-DIMM
two ranks 512MB DIMM
two ranks 512MB ECC-DIMM
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic
equipment as defined in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January
2003. These substances include mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls and
polybrominated biphenyl ethers.
2) All part numbers end with a place code designating the silicon-die revision. Reference information available on request.
Example: HYS72D32000HU-6-C, indicating rev. C dies are used for SDRAM components. The Compliance Code is printed
on the module labels describing the speed sort (for example “PC2700”), the latencies and SPD code definition (for example
“20330” means CAS latency of 2.0 clocks, Row-Column-Delay (RCD) latency of 3 clocks, Row Precharge latency of
3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card used for this module.
Internet Data Sheet
4
Rev. 1.11, 2007 - 01
09152006-1LHY-N6G4
QIMONDA [ QIMONDA AG ]
