Data Sheet
HY[B/E]18M1G16[0/1]BF
1-Gbit DDR Mobile-RAM
1.3
Description
The HY[B/E]18M1G16[0/1]BF is a high-speed CMOS, dynamic random-access memory containing 1,073,741,824 bits. It is
internally configured as a quad-bank DRAM.
The HY[B/E]18M1G16[0/1]BF uses a double-data-rate architecture to achieve high-speed operation. The double-data-rate
architecture is essentially a 2n pre fetch architecture, with an interface designed to transfer two data words per clock cycle at
the I/O balls. A single READ or WRITE access for the DDR Mobile-RAM consists of a single 2n-bit wide, one clock cycle data
transfer at the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O balls.
The HY[B/E]18M1G16[0/1]BF is especially designed for mobile applications. It operates from a 1.8V power supply. Power
consumption in self refresh mode is drastically reduced by an On-Chip Temperature Sensor (OCTS); it can further be reduced
by using the programmable Partial Array Self Refresh (PASR).
A conventional data-retaining Power-Down (PD) mode is available as well as a non-data-retaining Deep Power-Down (DPD)
mode. For further power-savings the clock may be stopped during idle periods.
The HY[B/E]18M1G16[0/1]BF is housed in a 60-ball PG-VFBGA-60-6 package. It is available in Commercial (-0°C to +70°C)
and Extended (-25°C to +85°C) temperature range.
This product provides two options in Clock Enable (CKE) configurations – 1 CKE and 2 CKE, in addition to the 2 Chip Select
scheme. The options provide independent control of CS and CKE of each DRAM dies as required to achieve low power
consumption.
For example, a possible combination is that while one DRAM die is in active mode, the other could be in standby via
independent CS control, or in Deep Power Down mode via independent CS and CKE control. As shown in Table 26 SDRAM
Maximum Operating Currents, number of figures for various scenarios are demonstrated, where one die is in active mode
controlled by CS0; the other is in standby mode controlled by CS1 (for 1 CKE option), or in Power-Down mode controlled by
CKE1 (for 2 CKE option).
The HY[B/E]18M1G16[0/1]BF package contains two dies, each die assigned a separate chip select, which is functionally
equivalent to having two seperate BGA components, with each component containing one die. The same functional limitations
apply and care must be taken to avoid possible bus contention, since both dies share the same data bus. Any back-to-back
read or write from a different die can only start when the existing burst operation is completed. For example, restricted
operations involving two dies may include:
•
•
•
•
Consecutive READ/WRITE bursts,
Random READ/WRITE accesses,
READ or WRITE truncations, and
Simultaneous READ or WRITE on both dies
In case of an ongoing read burst, the Burst Terminate (BST) command can be used before any access from the different die
occurs.
The dual-die device must follow the predefined command sequences for power-up and initialization. The operation can be
performed for the two dies together or separately.
Note: All the timing diagrams of operations shown int the following sections assume that operations occur within the same die.
Rev.1.0, 2007-03
6
10242006-Y557-TZXW
QIMONDA [ QIMONDA AG ]
