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HYB18H512321AF-12 参数 Datasheet PDF下载

HYB18H512321AF-12图片预览
型号: HYB18H512321AF-12
PDF下载: 下载PDF文件 查看货源
内容描述: [Synchronous Graphics RAM, 16MX32, 0.22ns, CMOS, PBGA136, 11 X 14 MM, GREEN, PLASTIC, MO-207IDR-Z, TFBGA-136]
分类和应用: 时钟动态存储器内存集成电路
文件页数/大小: 100 页 / 1884 K
品牌: QIMONDA [ QIMONDA AG ]
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HYB18H512321AF  
512-Mbit GDDR3  
Pin Configuration  
Table 2  
Ball  
Ball Description  
Type Detailed Function  
ZQ  
-
ODT Impedance Reference: The ZQ ball is used to control the ODT impedance.  
RES  
Input Reset pin: The RES pin is a VDDQ CMOS input. RES is not internally terminated. When  
RES is at LOW state the chip goes into full reset. The chip stays in full reset until RES goes  
to HIGH state. The Low to High transition of the RES signal is used to latch the CKE value  
to set the value of the termination resistors of the address and command inputs. After  
exiting the full reset a complete initialization is required since the full reset set the internal  
settings to default.  
MF  
Input Mirror function pin: The MF pin is a VDDQ CMOS input. This pin must be hardwired on  
board either to a power or to a ground plane. With MF set to HIGH, the command and  
address pins are reassigned in order to allow for an easier routing on board for a back to  
back memory arrangement.  
SEN  
VREF  
Input Enables Boundary Scan Functionality. If Boundary Scan is not used PIN should be  
constantly connected to GND.  
Supply Voltage Reference: VREF is the reference voltage input.  
VDD, VSS,  
VDDA, VSSA  
Supply Power Supply: Power and Ground for the internal logic. VDD and VDDA must be provided  
by the same power rail. Shorted in the package.  
VDDQ, VSSQ Supply I/O Power Supply: Isolated Power and Ground for the output buffers to provide improved  
noise immunity.  
NC, RFU  
-
Please do not connect No Connect and Reserved for Future Use balls.  
2.2  
Mirror Function  
The GDDR3 Graphics RAM provides a ball mirroring feature that is enabled by applying a logic HIGH on ball MF.  
This function allows for efficient routing in a clam shell configuration.  
Depending of the logic state applied on MF, the command and address signals will be assigned to different balls.  
The default ball configuration (see Figure 1) correponds to MF = LOW.  
The DC level (HIGH or LOW) must be applied on the MF pin at power up and is not allowed to change after that.  
Table 3 shows the ball assignment as a function of the logic state applied on MF.  
Table 3  
Ball Assignment with Mirror  
MF Logic State  
Signal  
LOW  
H3  
F4  
H9  
F9  
HIGH  
H10  
F9  
H4  
F4  
RAS  
CAS  
WE  
CS  
CKE  
A0  
H4  
K4  
H9  
K9  
H2  
K3  
M4  
K9  
H11  
K10  
M9  
K4  
A1  
A2  
A3  
A4  
H11  
K10  
H2  
K3  
A5  
A6  
Data Sheet  
13  
Rev. 1.73, 2005-08  
05122004-B1L1-JEN8  
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