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HYB18H256321BF-11/12/14 参数 Datasheet PDF下载

HYB18H256321BF-11/12/14图片预览
型号: HYB18H256321BF-11/12/14
PDF下载: 下载PDF文件 查看货源
内容描述: 256兆GDDR3图形内存GDDR3图形内存 [256-Mbit GDDR3 Graphics RAM GDDR3 Graphics RAM]
分类和应用: 双倍数据速率
文件页数/大小: 41 页 / 2032 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HYB18H256321BF  
256-Mbit GDDR3  
1.2  
Description  
The Qimonda 256-Mbit GDDR3 Graphics RAM is a high speed memory device, designed for high bandwidth intensive  
applications like PC graphics systems. The chip’s 4 bank architecture is optimized for high speed.  
HYB18H256321BF uses a double data rate interface and a 4n-pre fetch architecture. The GDDR3 interface transfers two 32  
bit wide data words per clock cycle to/from the I/O pins. Corresponding to the 4n-pre fetch a single write or read access consists  
of a 128 bit wide, one-clock-cycle data transfer at the internal memory core and four corresponding 32 bit wide, one-half-clock-  
cycle data transfers at the I/O pins.  
Single-ended unidirectional Read and Write Data strobes are transmitted simultaneously with Read and Write data respectively  
in order to capture data properly at the receivers of both the Graphics SDRAM and the controller. Data strobes are organized  
per byte of the 32 bit wide interface. For read commands the RDQS are edge-aligned with data, and the WDQS are center-  
aligned with data for write commands.  
The HYB18H256321BF operates from a differential clock (CLK and CLK). Commands (addresses and control signals) are  
registered at every positive edge of CLK. Input data is registered on both edges of WDQS, and output data is referenced to  
both edges of RDQS.  
In this document references to “the positive edge of CLK” imply the crossing of the positive edge of CLK and the negative edge  
of CLK. Similarly, the “negative edge of CLK” refers to the crossing of the negative edge of CLK and the positive edge of CLK.  
References to RDQS are to be interpreted as any or all RDQS<3:0>. WDQS, DM and DQ should be interpreted in a similar  
fashion.  
Read and write accesses to the HYB18H256321BF are burst oriented. The burst length is fixed to 4 and 8 and the two least  
significant bits of the burst address are “Don’t Care” and internally set to LOW. Accesses begin with the registration of an  
ACTIVATE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the  
ACTIVATE command are used to select the bank and the row to be accessed. The address bits registered coincident with the  
READ or WRITE command are used to select the bank and the column location for the burst access. Each of the 4 banks  
consists of 4096 row locations and 512 column locations. An AUTO PRECHARGE function can be combined with READ and  
WRITE to provide a self-timed row precharge that is initiated at the end of the burst access. The pipe lined, multibank  
architecture of the HYB18H256321BF allows for concurrent operation, thereby providing high effective bandwidth by hiding row  
precharge and activation time.  
The “On Die Termination” interface (ODT) is optimized for high frequency digital data transfers and is internally controlled. The  
termination resistor value can be set using an external ZQ resistor or disabled through the Extended Mode Register.  
The output driver impedance can be set using the Extended Mode Register. It can either be set to ZQ / 6 (auto calibration) or  
to 35, 40 or 45 Ohms.  
Auto Refresh and Power Down with Self Refresh operations are supported.  
An industrial standard PG–TFBGA–136 package is used which enables ultra high speed data transfer rates and a simple  
upgrade path from former DDR Graphics SDRAM products.  
Rev. 0.80, 2007-09  
4
09132007-07EM-7OYI