TOP242-249
TO-263-7C
.396 (10.06)
.415 (10.54)
.245 (6.22)
min.
.045 (1.14)
.055 (1.40)
.055 (1.40)
.066 (1.68)
.225 (5.72)
min.
.326 (8.28)
.336 (8.53)
.580 (14.73)
.620 (15.75)
.000 (0.00)
.010 (0.25)
.208 (5.28)
Ref.
.090 (2.29)
.110 (2.79)
-A-
.010 (0.25)
LD #1
.017 (0.43)
.023 (0.58)
.026 (0.66)
.032 (0.81)
.100 (2.54)
Ref.
.050 (1.27)
°
°
8 -
0
.315 (8.00)
Solder Pad
Dimensions
.165 (4.19)
.185 (4.70)
.380 (9.65)
.004 (0.10)
Notes:
.638 (16.21)
1. Package Outline Exclusive of Mold Flash & Metal Burr.
2. Package Outline Inclusive of Plating Thickness.
3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
.128 (3.25)
R07C
.050 (1.27)
.038 (0.97)
4. Controlling Dimensions are in Inches. Millimeter
Dimensions are shown in Parentheses.
PI-2664-040501
E
7/01
August 8, 2000
47
POWERINT [ Power Integrations ]
