TOP242-250
TO-263-7C
.390 (9.91)
.420 (10.67)
.045 (1.14)
.055 (1.40)
.245 (6.22)
MIN
.055 (1.40)
.066 (1.68)
.225 (5.72)
MIN
.326 (8.28)
.336 (8.53)
.580 (14.73)
.620 (15.75)
.000 (0.00)
.010 (0.25)
.208 (5.28)
Ref.
.090 (2.29)
.110 (2.79)
-A-
.010 (0.25)
0.68 (1.73)
MIN
.012 (0.30)
.024 (0.61)
LD #1
.024 (0.61)
.034 (0.86)
.100 (2.54)
REF
.050 (1.27)
°
°
0 - 8
.315 (8.00)
.165 (4.19)
.185 (4.70)
Solder Pad
Dimensions
.004 (0.10)
.380 (9.65)
Notes:
1. Package Outline Exclusive of Mold Flash & Metal Burr.
2. Package Outline Inclusive of Plating Thickness.
3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
4. Controlling Dimensions are in Inches. Millimeter
Dimensions are shown in Parentheses.
.638 (16.21)
.128 (3.25)
R07C
PI-2664-122004
.050 (1.27)
.038 (0.97)
5. Minimum metal to metal spacing at the package body
for the omitted pin locations is .068 in. (1.73 mm).
M
12/04
49
POWERINT [ Power Integrations ]
