STANDARD PRODUCT
PM5365 TEMAP
DATASHEET
PMC-1991148
ISSUE 3
HIGH DENSITY VT/TU MAPPER
AND M13 MULTIPLEXER
VSS[36]
VSS[35]
VSS[34]
VSS[33]
VSS[32]
VSS[31]
VSS[30]
VSS[29]
VSS[28]
VSS[27]
VSS[26]
VSS[25]
VSS[24]
VSS[23]
VSS[22]
VSS[21]
VSS[20]
VSS[19]
VSS[18]
VSS[17]
VSS[16]
VSS[15]
VSS[14]
VSS[13]
VSS[12]
VSS[11]
VSS[10]
VSS[9]
J14
J13
J12
J11
J10
J9
Thermal Ground (VSS). The VSS[36:1] pins should
be connected to a ground plane for enhanced thermal
conductivity.
K14
K13
K12
K11
K10
K9
L14
L13
L12
L11
L10
L9
M14
M13
M12
M11
M10
M9
N14
N13
N12
N11
N10
N9
VSS[8]
VSS[7]
VSS[6]
P14
P13
P12
P11
P10
P9
VSS[5]
VSS[4]
VSS[3]
VSS[2]
VSS[1]
NOTES ON PIN DESCRIPTIONS:
1. All TEMAP inputs and bi-directionals present minimum capacitive loading and
operate at TTL logic levels.
2. All TEMAP outputs and bi-directionals have at least 2 mA drive capability.
The bidirectional data bus outputs, D[7:0], have 4 mA drive capability. The
outputs TCLK, TPOS/TDAT, TNEG/TMFP, RGAPCLK/RSCLK, RDATAO,
Proprietary and Confidential to PMC-Sierra, Inc. and for its Customers’ Internal Use
55
PMC [ PMC-SIERRA, INC ]
