Oxford Semiconductor, Inc.
OXU200 Data Sheet
Table 4 DC Characteristics, Logic Signals
Symbol
V
OL
V
OH
V
IL
V
IH
C
IN
C
OUT
C
BI
I
IN
Note:
Parameter
Low-level output voltage
High-level output voltage
Low-level input voltage
High-level input voltage
Input capacitance
Output capacitance
Bi-directional capacitance
Input leakage current
V
DDW
= 3.3 V
V
DDW
= 1.8 V
V
DDW
= 3.3 V
V
DDW
= 1.8 V
V
DDW
= 3.3 V
V
DDW
= 1.8 V
Condition
Min
2.4
0.75*V
DDW
Max
0.4
Unit
V
V
V
0.8
0.3*V
DDW
2.0
0.7*V
DDW
2.2 (typical)
2.2 (typical)
2.2 (typical)
V
V
V
V
pF
pF
pF
µA
No pull up or pull down
-10
10
The capacitances listed above do not include pad capacitance and package capacitance.
One can estimate pin capacitance by adding pad capacitance of about 0.5 pF and the
package capacitance, which is about 0.86 pF max for LQFP.
Table 5 DC Characteristics, Regulator
Symbol
V
rout
I
rdrive
t
rst
Note:
Parameter
Output voltage
Driving current
Start-up time when enabled
Condition
Driving current <= 100 mA
V
DD3.3A
= 3.3 V
Output voltage = 1.8 V
V
DD3.3A
= 3.3 V
V
REGOUT
= 1.62 V (90%)
Min
Max
150
Unit
V
mA
µs
1.8 (typical)
25 (typical)
The V
DD3.3A
pin that corresponds to the regulator supply is QFP pin 81.
Table 6 AC Characteristics, High-Speed D
P
and
D
M
Driver Characteristics
Symbol
t
HSR
t
HSF
R
DRV
Parameter
High-speed differential rise time
High-speed differential fall time
Driver output impedance
Equivalent resistance used as internal
chip
Condition
Min
500
500
40.5
49.5
Max
Unit
ps
ps
Ω
DS-0051
Mar 07
External—Free Release
5
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