TEA1532
Philips Semiconductors
GreenChip II SMPS control IC
21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
14
14.1
14.2
14.2.1
14.2.2
14.3
14.3.1
14.3.2
14.3.3
14.4
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Through-hole mount packages . . . . . . . . . . . 22
Soldering by dipping or by solder wave . . . . . 22
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 22
Surface mount packages . . . . . . . . . . . . . . . . 22
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 22
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information. . . . . . 24
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1
Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1
Protection features . . . . . . . . . . . . . . . . . . . . . . 1
2.1
2.2
2.3
3
4
5
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
15
16
17
18
19
20
Revision history . . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
7
7.1
Functional description . . . . . . . . . . . . . . . . . . . 4
Start-up, mains enabling operation level and
undervoltage lock out . . . . . . . . . . . . . . . . . . . . 6
Supply management. . . . . . . . . . . . . . . . . . . . . 6
Current control mode . . . . . . . . . . . . . . . . . . . . 6
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Demagnetization (QR operation) . . . . . . . . . . . 7
Continuous Conduction Mode (CCM). . . . . . . . 7
Overcurrent Protection (OCP) . . . . . . . . . . . . . 7
Control pin protection . . . . . . . . . . . . . . . . . . . . 7
Adjustable slope compensation . . . . . . . . . . . . 7
Minimum and maximum on-time. . . . . . . . . . . . 8
PROTECT and timing input . . . . . . . . . . . . . . . 8
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 9
Brown-out protection. . . . . . . . . . . . . . . . . . . . 10
OverTemperature Protection (OTP) . . . . . . . . 11
Soft start-up (pin SENSE). . . . . . . . . . . . . . . . 11
Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics. . . . . . . . . . . . . . . . . . 13
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13
Application information. . . . . . . . . . . . . . . . . . 15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 19
Quality information . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
9
10
11
12
12.1
13
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 28 May 2004
Document order number: 9397 750 13113
Published in The Netherlands
NXP [ NXP ]
