TEA1532
Philips Semiconductors
GreenChip II SMPS control IC
14.4 Package related soldering information
Table 6:
Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package [1]
Soldering method
Wave
Reflow[2] Dipping
Through-hole
mount
DBS, DIP, HDIP, RDBS,
SDIP, SIL
suitable[3]
−
suitable
Through-hole-
surface mount
PMFP[4]
not suitable
not suitable
not
suitable
−
−
Surface mount
BGA, LBGA, LFBGA,
SQFP, SSOP-T[5], TFBGA,
VFBGA
suitable
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[6]
suitable
−
PLCC[7], SO, SOJ
suitable
suitable
−
−
−
LQFP, QFP, TQFP
not recommended [7] [8] suitable
not recommended[9]
suitable
SSOP, TSSOP, VSO,
VSSOP
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[4] Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[9] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9397 750 13113
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 — 28 May 2004
24 of 27
NXP [ NXP ]
