Philips Semiconductors
Objective specification
Integrated PAL and PAL/NTSC TV
processors
TDA8360; TDA8361; TDA8362
PACKAGE OUTLINE
15.80
15.24
47.92
47.02
handbook, full pagewidth
4.57
max
5.08
max
3.2
2.8
0.51
min
0.18
M
0.32 max
1.73
max
0.53
max
1.778
(25x)
15.24
17.15
15.90
1.3 max
MSA267
52
27
14.1
13.7
1
26
Dimensions in mm.
Fig.14 52-lead shrink dual in-line; plastic (SOT247AG).
SOLDERING
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
March 1994
31
NXP [ NXP ]
