Philips Semiconductors
Product specification
Baseband delay line
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil)
TDA4665
SOT38-4
D
seating plane
M
E
A
2
A
L
A
1
c
Z
e
b
1
b
16
9
b
2
M
H
w
M
(e
1
)
pin 1 index
E
1
8
0
5
scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
4.2
0.17
A
1
min.
0.51
0.020
A
2
max.
3.2
0.13
b
1.73
1.30
0.068
0.051
b
1
0.53
0.38
0.021
0.015
b
2
1.25
0.85
0.049
0.033
c
0.36
0.23
0.014
0.009
D
(1)
19.50
18.55
0.77
0.73
E
(1)
6.48
6.20
0.26
0.24
e
2.54
0.10
e
1
7.62
0.30
L
3.60
3.05
0.14
0.12
M
E
8.25
7.80
0.32
0.31
M
H
10.0
8.3
0.39
0.33
w
0.254
0.01
Z
(1)
max.
0.76
0.030
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT38-4
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
1996 Dec 17
8
PHILIPS [ NXP SEMICONDUCTORS ]
