Philips Semiconductors
Product specification
Baseband delay line
PINNING
SYMBOL
V
P2
n.c.
GND2
i.c.
SAND
n.c.
i.c.
i.c.
V
P1
GND1
V
o(R−Y)
V
o(B−Y)
n.c.
V
i(B−Y)
n.c.
V
i(R−Y)
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
DESCRIPTION
+5 V supply voltage for digital part
not connected
ground for digital part (0 V)
internally connected
sandcastle pulse input
not connected
internally connected
internally connected
+5 V supply voltage for analog part
ground for analog part (0 V)
±(R−Y)
output signal
±(B−Y)
output signal
not connected
±(B−Y)
input signal
not connected
±(R−Y)
input signal
Fig.2 Pin configuration.
i.c. 4
handbook, halfpage
TDA4665
VP2 1
n.c. 2
GND2 3
16 Vi(R−Y)
15 n.c.
14 Vi(B−Y)
13 n.c.
TDA4665
SAND 5
n.c. 6
i.c. 7
i.c. 8
MED849
12 Vo(B−Y)
11 Vo(R−Y)
10 GND1
9
VP1
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Ground pins 3 and 10 connected together.
SYMBOL
V
P1
V
P2
V
5
V
n
T
stg
T
amb
V
ESD
Note
1. Equivalent to discharging a 200 pF capacitor through a 0
Ω
series resistor.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
SOT38-4
SOT109-1
PARAMETER
thermal resistance from junction to ambient in free air
75
220
K/W
K/W
VALUE
UNIT
digital supply voltage (pin 1)
voltage on pin 5
voltage on pins 11, 12, 14 and 16
storage temperature
operating ambient temperature
electrostatic handling for all pins; note 1
PARAMETER
analog supply voltage (pin 9)
MIN.
−0.5
−0.5
−0.5
−0.5
−25
0
−
MAX.
+7
+7
V
P
+ 1.0
V
P
+150
70
±500
V
V
V
V
°C
°C
V
UNIT
1996 Dec 17
4
PHILIPS [ NXP SEMICONDUCTORS ]
