Philips Semiconductors
Product specification
Digital video encoder
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
8
8.1
8.2
9
9.1
10
11
11.1
11.2
11.3
11.4
11.5
12
13
14
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Versatile fader
Data manager
Encoder
RGB processor
SECAM processor
Output interface/DACs
Synchronization
Clock
I
2
C-bus interface
Input levels and formats
Bit allocation map
I
2
C-bus format
Slave receiver
Slave transmitter
CHARACTERISTICS
Explanation of RTCI data bits
Teletext timing
APPLICATION INFORMATION
Analog output voltages
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
SAA7128H; SAA7129H
2000 Mar 08
2
PHILIPS [ NXP SEMICONDUCTORS ]
