Philips Semiconductors
Product specification
Dual P-channel enhancement
mode MOS transistor
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
PHP225
SOT96-1
D
E
A
X
c
y
H
E
v
M
A
Z
8
5
Q
A
2
A
1
pin 1 index
θ
L
p
1
e
b
p
4
w
M
L
detail X
(A
3
)
A
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
1.75
0.069
A
1
0.25
0.10
A
2
1.45
1.25
A
3
0.25
0.01
b
p
0.49
0.36
c
0.25
0.19
D
(1)
5.0
4.8
0.20
0.19
E
(2)
4.0
3.8
0.16
0.15
e
1.27
0.050
H
E
6.2
5.8
L
1.05
L
p
1.0
0.4
Q
0.7
0.6
v
0.25
0.01
w
0.25
0.01
y
0.1
0.004
Z
(1)
0.7
0.3
0.028
0.012
θ
0.010 0.057
0.004 0.049
0.019 0.0100
0.014 0.0075
0.244
0.039 0.028
0.041
0.228
0.016 0.024
8
0
o
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT96-1
REFERENCES
IEC
076E03S
JEDEC
MS-012AA
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
97-05-22
1997 Jun 20
9
PHILIPS [ NXP SEMICONDUCTORS ]
