PDIUSBD12
USB interface device with parallel bus
Philips Semiconductors
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
E
A
X
c
H
v
M
y
A
E
Z
15
28
Q
A
2
(A )
3
A
A
pin 1 index
1
θ
L
p
L
1
14
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.8
0.5
mm
1.10
0.65
0.25
1.0
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
99-12-27
SOT361-1
MO-153
Fig 24. TSSOP28 package outline.
9397 750 09238
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
Product data
Rev. 08 — 20 December 2001
30 of 35
NXP [ NXP ]
