Philips Semiconductors
Product specification
Universal LCD driver for low multiplex
rates
CONTENTS
1
2
3
4
5
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
6.15
6.16
6.17
6.18
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
FEATURES
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Power-on reset
LCD bias generator
LCD voltage selector
LCD drive mode waveforms
Oscillator
Internal clock
External clock
Timing
Display latch
Shift register
Segment outputs
Backplane outputs
Display RAM
Data pointer
Subaddress counter
Output bank selector
Input bank selector
Blinker
I
2
C-BUS DESCRIPTION
Bit transfer
Start and stop conditions
System configuration
Acknowledge
PCF8566 I
2
C-bus controller
Input filters
I
2
C-bus protocol
Command decoder
Display controller
Cascaded operation
8
9
10
11
12
13
14
15
15.1
15.2
15.2.1
15.2.2
15.3
15.3.1
15.3.2
15.3.3
16
17
18
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
PCF8566
APPLICATION INFORMATION
CHIP DIMENSIONS AND BONDING PAD
LOCATIONS
PACKAGE OUTLINES
SOLDERING
Introduction
DIP
Soldering by dipping or by wave
Repairing soldered joints
SO and VSO
Reflow soldering
Wave soldering
Repairing soldered joints
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
1998 May 04
2
PHILIPS [ NXP SEMICONDUCTORS ]
