NXP Semiconductors
PCF8563
Real-time clock/calendar
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
HE
v
M
A
Z
8
5
A2
pin 1 index
A1
(A3)
A
θ
Lp
L
1
e
bp
4
detail X
w
M
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
max.
1.1
A1
0.15
0.05
A2
0.95
0.80
A3
0.25
bp
0.45
0.25
c
0.28
0.15
D
(1)
3.1
2.9
E
(2)
3.1
2.9
e
0.65
HE
5.1
4.7
L
0.94
Lp
0.7
0.4
v
0.1
w
0.1
y
0.1
Z
(1)
0.70
0.35
θ
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
Fig 33. Package outline SOT505-1 (TSSOP8) of PCF8563TS
PCF8563
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 10 — 3 April 2012
40 of 50
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