PCF8563
NXP Semiconductors
Real-time clock/calendar
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 34. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
18. Abbreviations
Table 33. Abbreviations
Acronym
BCD
CDM
CMOS
ESD
HBM
I2C
Description
Binary Coded Decimal
Charged-Device Model
Complementary Metal Oxide Semiconductor
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit
Integrated Circuit
IC
LSB
Least Significant Bit
Most Significant Bit
MSB
MSL
PCB
POR
RTC
SCL
Moisture Sensitivity Level
Printed-Circuit Board
Power-On Reset
Real-Time Clock
Serial CLock line
SDA
SMD
Serial DAta line
Surface Mount Device
PCF8563
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 10 — 3 April 2012
43 of 50
NXP [ NXP ]
