PCF8563
NXP Semiconductors
Real-time clock/calendar
15. Package outline
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
SOT650-1
0
1
2 mm
scale
X
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
e
1
terminal 1
index area
y
y
v
M
e
C
C
A
B
b
C
1
1
5
w
M
L
E
h
6
10
D
h
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
(1)
(1)
UNIT
A
b
E
e
e
y
c
D
D
E
L
v
w
y
1
1
h
1
h
0.05 0.30
0.00 0.18
3.1
2.9
2.55
2.15
3.1
2.9
1.75
1.45
0.55
0.30
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-01-22
02-02-08
SOT650-1
- - -
MO-229
- - -
Fig 30. Package outline SOT650-1 (HVSON10) of PCF8563BS
PCF8563
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 10 — 3 April 2012
37 of 50
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