KMA220
NXP Semiconductors
Dual channel programmable angle sensor
21. Handling information
(1)
(2)
(1)
0.7
aaa-000907
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 21. Bending recommendation
22. Solderability information
The solderability qualification is according to AEC-Q100 Rev-G. Recommended soldering
process for leaded devices is wave soldering. The maximum soldering temperature is
260 C for maximum 5 s. Device terminals are compatible with laser and electrical
welding.
23. Revision history
Table 29. Revision history
Document ID
Release date
20120524
Data sheet status
Change notice
Supersedes
KMA220 v.1
Product data sheet
-
-
KMA220
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 24 May 2012
33 of 36
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