KMA220
NXP Semiconductors
Dual channel programmable angle sensor
20. Package outline
SIL4: plastic, single in-line package
SOT1188-1
E
1
E
B
E
2
H
H
E2
E1
A
C
Q
p
1
(Y)
q
A
p
(D )
5
D
3
D
4
(2)
(S)
x
#
#
alignment
(6)
area
D
2
D
D
1
(D
6
)
s
A B
pin 1 index
(2)
x - center of reading point
# - center of individual reading point
for customer reference
H
E
(1)
gate area
(1)
(L)
burr side
1
4
e
(3x)
w B
z C
C
b
(4x)
(ref)
(ref)
q
S
s
Y
w
z
0.2
0.95
0.90
0.85
0
3
5
10 mm
(5,6)
2.6
1.0 0.2 0.8
scale
Dimensions
Unit
(3)
(1)
(4, ref)
(ref)
(ref)
A
b
C
D
D
D
D
D
4
D
D
E
E
E
2
e
H
H
H
L
p
p
1
Q
1
2
5
6
1
E
E1
E2
max 2.05 0.85 0.30 11.15 10.62
mm nom 1.95 0.80 0.27 11.00 10.47 7.81 1.6 1.95 0.27 12.93 7.4 8.00 7.8 1.8 20.5 5.80
min 1.85 0.75 0.24 10.85 10.32 1.5 1.85 7.3 7.95 7.7 20.3 5.75
1.7 2.05
7.5 8.05 7.9
20.7 5.85 6.20
1.05 4.05 0.95
7.9 1.00 4.00 0.90
0.95 3.95 0.85
Note
1. Gate area, up to 0.2 mm protrusion possible at both sides.
2. Terminal and plastic uncontrolled in this area.
3. Burr not included.
4. Measured at the cutting edge of the fin radius.
5. Measured along the straight edge of the package above note 1.
6. Alignment area, up to 1.5 mm long rim break outs can reduce E1 dimension.
sot1188-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
12-03-29
12-05-14
SOT1188-1
Fig 20. Package outline SOT1188-1 (SIL4)
KMA220
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 24 May 2012
32 of 36
NXP [ NXP ]
