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IRFZ44N 参数 Datasheet PDF下载

IRFZ44N图片预览
型号: IRFZ44N
PDF下载: 下载PDF文件 查看货源
内容描述: N沟道增强模式的TrenchMOS晶体管 [N-channel enhancement mode TrenchMOS transistor]
分类和应用: 晶体晶体管功率场效应晶体管开关脉冲局域网
文件页数/大小: 8 页 / 67 K
品牌: PHILIPS [ NXP SEMICONDUCTORS ]
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Philips Semiconductors
Product specification
N-channel enhancement mode
TrenchMOS
TM
transistor
STATIC CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL
V
(BR)DSS
V
GS(TO)
I
DSS
I
GSS
±V
(BR)GSS
R
DS(ON)
PARAMETER
Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Gate source leakage current
CONDITIONS
V
GS
= 0 V; I
D
= 0.25 mA;
T
j
= -55˚C
V
DS
= V
GS
; I
D
= 1 mA
T
j
= 175˚C
T
j
= -55˚C
V
DS
= 55 V; V
GS
= 0 V;
V
GS
=
±10
V; V
DS
= 0 V
T
j
= 175˚C
T
j
= 175˚C
T
j
= 175˚C
MIN.
55
50
2.0
1.0
-
-
-
-
-
16
-
-
TYP.
-
-
3.0
-
-
0.05
-
0.04
-
-
15
-
IRFZ44N
MAX.
-
-
4.0
-
4.4
10
500
1
20
-
22
42
UNIT
V
V
V
V
µA
µA
µA
µA
V
mΩ
mΩ
Gate source breakdown voltage I
G
=
±1
mA;
Drain-source on-state
V
GS
= 10 V; I
D
= 25 A
resistance
DYNAMIC CHARACTERISTICS
T
mb
= 25˚C unless otherwise specified
SYMBOL
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
t
d on
t
r
t
d off
t
f
L
d
L
d
L
s
PARAMETER
Forward transconductance
Input capacitance
Output capacitance
Feedback capacitance
Total gate charge
Gate-cource charge
Gate-drain (miller) charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Internal drain inductance
Internal drain inductance
Internal source inductance
CONDITIONS
V
DS
= 25 V; I
D
= 25 A
V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz
MIN.
6
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
-
1350
330
155
-
-
-
18
50
40
30
3.5
4.5
7.5
MAX.
-
1800
400
215
62
15
26
26
75
50
40
-
-
-
UNIT
S
pF
pF
pF
nC
nC
nC
ns
ns
ns
ns
nH
nH
nH
V
DD
= 44 V; I
D
= 50 A; V
GS
= 10 V
V
DD
= 30 V; I
D
= 25 A;
V
GS
= 10 V; R
G
= 10
Resistive load
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL
I
DR
I
DRM
V
SD
t
rr
Q
rr
PARAMETER
Continuous reverse drain
current
Pulsed reverse drain current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
CONDITIONS
MIN.
-
I
F
= 25 A; V
GS
= 0 V
I
F
= 40 A; V
GS
= 0 V
I
F
= 40 A; -dI
F
/dt = 100 A/µs;
V
GS
= -10 V; V
R
= 30 V
-
-
-
-
-
TYP.
-
-
0.95
1.0
47
0.15
MAX.
49
160
1.2
-
-
-
UNIT
A
A
V
ns
µC
February 1999
2
Rev 1.000